JOURNAL ARTICLE

Recent Developments in Magnetron Sputtering

Xiang YuWang Cheng-biaoYang LiuYu DeyangTingyan Xing

Year: 2006 Journal:   Plasma Science and Technology Vol: 8 (3)Pages: 337-343   Publisher: IOP Publishing

Abstract

The principle of magnetron sputtering is introduced and the balanced and unbalanced magnetrons are compared and the necessity of unbalanced magnetrons is explained as well. Several recent developments in plasma magnetron sputtering, i.e., unbalanced magnetron sputtering, pulsed magnetron sputtering and ion assisted sputtering, are discussed. The recent developments of unbalanced magnetron systems and their incorporation with ion sources result in an understanding in growing importance of the magnetron sputtering technology, which makes the technology an applicable deposition process for a variety of important films, such as wear-resistant films and decorative films.

Keywords:
Sputter deposition Cavity magnetron Sputtering High-power impulse magnetron sputtering Materials science Optoelectronics Engineering physics Plasma Deposition (geology) Ion Thin film Nanotechnology Chemistry Engineering Physics Nuclear physics Geology

Metrics

28
Cited By
1.93
FWCI (Field Weighted Citation Impact)
46
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Diamond and Carbon-based Materials Research
Physical Sciences →  Materials Science →  Materials Chemistry
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials

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