BOOK-CHAPTER
Non-Contact Cleaning Process for Post-CMP Copper
Daniel A. KoosJulia SvirchevskiD. J. VitkavageDavid Grube HansenKaren A. ReinhardtFrank T. HuangMarie MitchelGuang Ying Zhang
Year: 2005 Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena Pages: 291-296 Publisher: Scientific.net
Keywords:
Copper Materials science Process (computing) Metallurgy Computer science Operating system
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Topics
Advanced Surface Polishing Techniques
Physical Sciences → Engineering → Biomedical Engineering
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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