BOOK-CHAPTER
Copper Post-CMP Cleaning
Keywords:
Chemical-mechanical planarization Copper Materials science Dissolution Slurry Abrasive Wafer Copper interconnect Electrolyte Electrochemistry Polishing Aqueous solution Metallurgy Electrode Chemical engineering Composite material Nanotechnology Chemistry
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1
Cited By
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FWCI (Field Weighted Citation Impact)
18
Refs
0.17
Citation Normalized Percentile
Is in top 1%
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Citation History
Topics
Advanced Surface Polishing Techniques
Physical Sciences → Engineering → Biomedical Engineering
Advanced Machining and Optimization Techniques
Physical Sciences → Engineering → Electrical and Electronic Engineering
Anodic Oxide Films and Nanostructures
Physical Sciences → Materials Science → Materials Chemistry
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BOOK-CHAPTER
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