Effect on Lead-free Solder Joint Reliability Caused by Solder Volume

Mistuharu YAMABE; Masako FUKUMITSU; Yoshitoshi FUKUCHI

doi:10.2207/jjws.79.220

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JOURNAL ARTICLE

Effect on Lead-free Solder Joint Reliability Caused by Solder Volume

Mistuharu YAMABE Masako FUKUMITSU Yoshitoshi FUKUCHI

Year: 2010 Journal: JOURNAL OF THE JAPAN WELDING SOCIETY Vol: 79 (3)Pages: 220-225

DOI: 10.2207/jjws.79.220

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Keywords:

Soldering Lead (geology) Reliability (semiconductor) Joint (building) Materials science Volume (thermodynamics) Metallurgy Solder paste Reliability engineering Structural engineering Engineering Geology Thermodynamics Physics

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

VLSI and Analog Circuit Testing

Physical Sciences → Computer Science → Hardware and Architecture

Effect on Lead-free Solder Joint Reliability Caused by Solder Volume

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