BOOK-CHAPTER

Lead-Free Solder Joint Reliability

Keywords:
Soldering Eutectic system Materials science Lead (geology) Metallurgy Electronics Reliability (semiconductor) Joint (building) Alloy Engineering Electrical engineering

Metrics

9
Cited By
0.95
FWCI (Field Weighted Citation Impact)
12
Refs
0.79
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Aluminum Alloy Microstructure Properties
Physical Sciences →  Engineering →  Aerospace Engineering

Related Documents

JOURNAL ARTICLE

Design for BGA Lead-Free Solder Joint Reliability

Scott K. Buttars

Journal:   SMTA International Year: 2006 Vol: 8 (1)
JOURNAL ARTICLE

Effect on Lead-free Solder Joint Reliability Caused by Solder Volume

Mistuharu YAMABEMasako FUKUMITSUYoshitoshi FUKUCHI

Journal:   JOURNAL OF THE JAPAN WELDING SOCIETY Year: 2010 Vol: 79 (3)Pages: 220-225
© 2026 ScienceGate Book Chapters — All rights reserved.