JOURNAL ARTICLE
High solder joint reliability with lead free solders
Abstract
Recently. preventing environmental pollutions. lead-free (Pb-free) soldcrs are about to replace tin-lead (Sn-Pbj eutectic solders. Sn-Ag-Cu alloys arc lcading candidatcs for lead free solders. However. Sn-Ag-Cu alloys were not satisfied to meet sever custoiner requirements. At first, optimum silver wt%
Keywords:
Soldering Joint (building) Reliability (semiconductor) Lead (geology) Materials science Reliability engineering Metallurgy Computer science Engineering Structural engineering Geology Physics
Metrics
70
Cited By
7.38
FWCI (Field Weighted Citation Impact)
5
Refs
0.98
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Material Properties and Applications
Physical Sciences → Materials Science → General Materials Science
Engineering and Materials Science Studies
Physical Sciences → Engineering → Mechanical Engineering
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