Solder joint reliability of lead-free solder balls assembled with snpb solder paste

H. Theuss; T. Kilger; Th. V. Ort

doi:10.1109/ectc.2003.1216298

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Solder joint reliability of lead-free solder balls assembled with snpb solder paste

H. Theuss T. Kilger Th. V. Ort

Year: 2004 Pages: 331-337

DOI: 10.1109/ectc.2003.1216298

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Keywords:

Soldering Materials science Solder paste Joint (building) Metallurgy Reliability (semiconductor) Lead (geology) Electronic packaging Ball grid array Composite material Structural engineering Engineering

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Solder joint reliability of lead-free solder balls assembled with snpb solder paste

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