JOURNAL ARTICLE
Effect on lead-free solder joint reliability caused by solder volume
Mitsuharu YamabeMasako FukumitsuYoshitoshi Fukuchi
Year: 2011 Journal: Welding International Vol: 25 (11)Pages: 851-856 Publisher: Taylor & Francis
Abstract
Sn–37Pb, which consists of lead (Pb) and tin (Sn), has long been used as solder. Since 2000, however, due to the toxicity of lead, this has been replaced by Sn–3.0Ag–0.5Cu, in which silver and copp...
Keywords:
Soldering Lead (geology) Materials science Joint (building) Reliability (semiconductor) Metallurgy Volume (thermodynamics) Structural engineering Engineering Geology
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Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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