3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform
Yusheng BianKoushik RamachandranBo PengBrittany HedrickKeith DoneganJorge LubgubanBenjamin FasanoArmand RundquistJim PapeAslı ŞahinThomas HoughtonKaren NummyJay SteffesLouis MedinaSubharup Gupta RoyHarry CoxBart N. GreenKevin DezfulianWon Suk LeeAndy StrickerKate McLeanShuren HuZoey SowinskiColleen MeagherAbdelsalam AboketafMichał RakowskiMai RandallIan MelvilleDave RiggsAjey P. JacobRod AugurDaniel S. BergerAnthony W. YuKen GiewontJohn Pellerin
Abstract
A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.
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