JOURNAL ARTICLE
The adhesion of copper films deposited onto aluminum nitride
Jae‐Woo ParkA. J. PedrazaD. H. Lowndes
Year: 1999 Journal: Journal of Materials Science Vol: 34 (8)Pages: 1933-1942 Publisher: Springer Science+Business Media
Keywords:
Materials science Copper Auger electron spectroscopy Aluminium Annealing (glass) Irradiation Metal Thin film Adhesion Chemical engineering Composite material Metallurgy Nanotechnology
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