JOURNAL ARTICLE

The adhesion of copper films deposited onto aluminum nitride

Jae‐Woo ParkA. J. PedrazaD. H. Lowndes

Year: 1999 Journal:   Journal of Materials Science Vol: 34 (8)Pages: 1933-1942   Publisher: Springer Science+Business Media
Keywords:
Materials science Copper Auger electron spectroscopy Aluminium Annealing (glass) Irradiation Metal Thin film Adhesion Chemical engineering Composite material Metallurgy Nanotechnology

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