JOURNAL ARTICLE

Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

Jae-Won ParkAnthony J. PedrazaD. H. LowndesWilliam R. Allen

Year: 1997 Journal:   Journal of materials research/Pratt's guide to venture capital sources Vol: 12 (11)Pages: 3174-3181   Publisher: Springer Nature
Keywords:
Materials science Copper Annealing (glass) Auger electron spectroscopy Irradiation Oxide Substrate (aquarium) Aluminium Thin film Pulsed laser deposition Composite material Metallurgy Chemical engineering Nanotechnology

Metrics

11
Cited By
0.56
FWCI (Field Weighted Citation Impact)
15
Refs
0.66
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
High-Temperature Coating Behaviors
Physical Sciences →  Engineering →  Aerospace Engineering
Corrosion Behavior and Inhibition
Physical Sciences →  Materials Science →  Materials Chemistry

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