Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

Jae-Won Park; Anthony J. Pedraza; D. H. Lowndes; William R. Allen

doi:10.1557/jmr.1997.0414

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Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

Jae-Won Park Anthony J. Pedraza D. H. Lowndes William R. Allen

Year: 1997 Journal: Journal of materials research/Pratt's guide to venture capital sources Vol: 12 (11)Pages: 3174-3181 Publisher: Springer Nature

DOI: 10.1557/jmr.1997.0414

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Keywords:

Materials science Copper Annealing (glass) Auger electron spectroscopy Irradiation Oxide Substrate (aquarium) Aluminium Thin film Pulsed laser deposition Composite material Metallurgy Chemical engineering Nanotechnology

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

High-Temperature Coating Behaviors

Physical Sciences → Engineering → Aerospace Engineering

Corrosion Behavior and Inhibition

Physical Sciences → Materials Science → Materials Chemistry

Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

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