JOURNAL ARTICLE

Ultra high aspect ratio sub-micron silicon micromachining by double-passivation deep reactive ion etching

Keywords:
Materials science Deep reactive-ion etching Passivation Reactive-ion etching Surface micromachining Etching (microfabrication) Silicon Bulk micromachining Optoelectronics Microelectromechanical systems Aspect ratio (aeronautics) Nanotechnology Fabrication

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Topics

Nanowire Synthesis and Applications
Physical Sciences →  Engineering →  Biomedical Engineering
Advancements in Semiconductor Devices and Circuit Design
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Surface Polishing Techniques
Physical Sciences →  Engineering →  Biomedical Engineering

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