JOURNAL ARTICLE

An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon

Reza AbdolvandFarrokh Ayazi

Year: 2008 Journal:   Sensors and Actuators A Physical Vol: 144 (1)Pages: 109-116   Publisher: Elsevier BV
Keywords:
Passivation Deep reactive-ion etching Etching (microfabrication) Materials science Reactive-ion etching Trench Argon Silicon Sputtering Layer (electronics) Optoelectronics Nanotechnology Thin film Chemistry

Metrics

144
Cited By
7.70
FWCI (Field Weighted Citation Impact)
14
Refs
0.98
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Plasma Diagnostics and Applications
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advancements in Semiconductor Devices and Circuit Design
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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