Reactive ion etching for high aspect ratio silicon micromachining

Ivo W. Rangelow

doi:10.1016/s0257-8972(97)00284-3

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Reactive ion etching for high aspect ratio silicon micromachining

Ivo W. Rangelow

Year: 1997 Journal: Surface and Coatings Technology Vol: 97 (1-3)Pages: 140-150 Publisher: Elsevier BV

DOI: 10.1016/s0257-8972(97)00284-3

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Keywords:

Microelectromechanical systems Reactive-ion etching Materials science Etching (microfabrication) Fabrication Surface micromachining Deep reactive-ion etching Silicon Microelectronics Nanotechnology Dry etching Substrate (aquarium) Optoelectronics

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Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Plasma Diagnostics and Applications

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanowire Synthesis and Applications

Physical Sciences → Engineering → Biomedical Engineering

Reactive ion etching for high aspect ratio silicon micromachining

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