JOURNAL ARTICLE

Dissociation reactions of hydrogen in remote plasma-enhanced chemical-vapor-deposition silicon nitride

Christoph BoehmeG. Lucovsky

Year: 2001 Journal:   Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Vol: 19 (5)Pages: 2622-2628   Publisher: American Institute of Physics

Abstract

Dominant hydrogen dissociation reactions during annealing of hydrogenated amorphous-silicon nitride were determined by comparison of the bond density dynamics with various reaction models. The sample material was produced with remote plasma-enhanced chemical-vapor deposition, deposited at high-ammonia-to-silane flow ratios (ammonia rich). The heat treatment was performed with rapid thermal annealing at various annealing temperatures and times as well as samples containing different stoichiometries and isotopes (hydrogenated and deuterated). The experiments showed that hydrogen loss during annealing is mostly due to molecular hydrogen (H2) release as long as SiH bonds are contained in the film. After their exhaustion, an ammonia (NH3) producing reaction prevails at temperatures between 600 and 900 °C.

Keywords:
Dissociation (chemistry) Silane Hydrogen Annealing (glass) Chemical vapor deposition Silicon nitride Ammonia Stoichiometry Plasma-enhanced chemical vapor deposition Materials science Nitride Amorphous silicon Silicon Amorphous solid Deuterium Analytical Chemistry (journal) Chemical engineering Inorganic chemistry Chemistry Physical chemistry Crystalline silicon Nanotechnology Organic chemistry Atomic physics

Metrics

50
Cited By
3.65
FWCI (Field Weighted Citation Impact)
8
Refs
0.94
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Thin-Film Transistor Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced ceramic materials synthesis
Physical Sciences →  Materials Science →  Ceramics and Composites
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

Related Documents

JOURNAL ARTICLE

Deposition of silicon dioxide and silicon nitride by remote plasma enhanced chemical vapor deposition

G. LucovskyP. D. RichardD. V. TsuShin-Cheng LinR. J. Markunas

Journal:   Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Year: 1986 Vol: 4 (3)Pages: 681-688
JOURNAL ARTICLE

Silicon nitride and silicon diimide grown by remote plasma enhanced chemical vapor deposition

D. V. TsuG. Lucovsky

Journal:   Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Year: 1986 Vol: 4 (3)Pages: 480-485
JOURNAL ARTICLE

Plasma-Enhanced Chemical Vapor Deposition of Silicon Nitride

Ikunori KobayashiTetsu OgawaSadayoshi Hotta

Journal:   Japanese Journal of Applied Physics Year: 1992 Vol: 31 (2R)Pages: 336-336
JOURNAL ARTICLE

Regularities of remote plasma enhanced chemical vapor deposition of silicon nitride films

Sergey Alexandrov

Journal:   Russian Journal of General Chemistry Year: 2015 Vol: 85 (5)Pages: 1238-1251
© 2026 ScienceGate Book Chapters — All rights reserved.