Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging

Abstract

A new Micro Electro Mechanical System (MEMS) microstrip package using two high resistivity silicon (HRS) substrates without metal shielding is fabricated for microwave device packaging. The simple package is manufactured using common silicon MEMS technology and the de-embedding measurement shows the small insertion loss (0.3 dB) below 20 GHz and no package resonance. This package also allows the wafer-level chip-scale packaging and is suitable for low cost packaging of various microwave devices.