JOURNAL ARTICLE

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

Shuqi LiangYuan ChangChin ChenY. C. LiuKuei‐Hsien ChenS. H. Lin

Year: 2006 Journal:   Journal of Electronic Materials Vol: 35 (8)Pages: 1647-1654   Publisher: Springer Science+Business Media
Keywords:
Flip chip Current crowding Soldering Materials science Electromigration Finite element method Void (composites) Composite material Microstructure Chip Current (fluid) Structural engineering Electrical engineering Engineering Adhesive

Metrics

14
Cited By
2.02
FWCI (Field Weighted Citation Impact)
14
Refs
0.88
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials

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