Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

Shuqi Liang; Yuan Chang; Chin Chen; Y. C. Liu; Kuei‐Hsien Chen; S. H. Lin

doi:10.1007/s11664-006-0212-z

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Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

Shuqi Liang Yuan Chang Chin Chen Y. C. Liu Kuei‐Hsien Chen S. H. Lin

Year: 2006 Journal: Journal of Electronic Materials Vol: 35 (8)Pages: 1647-1654 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-006-0212-z

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Keywords:

Flip chip Current crowding Soldering Materials science Electromigration Finite element method Void (composites) Composite material Microstructure Chip Current (fluid) Structural engineering Electrical engineering Engineering Adhesive

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

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Citation History

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