Effect of polyimide baking on bump resistance in flip-chip solder joints

JOURNAL ARTICLE

Year: 2013 Journal: Microelectronics Reliability Vol: 54 (3)Pages: 629-632 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2013.11.006

Keywords:

Outgassing Soldering Materials science Flip chip Polyimide Composite material Metallurgy Adhesive Chemistry Layer (electronics)

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Cited By

0.21

FWCI (Field Weighted Citation Impact)

Refs

0.59

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials