Reliability of flip chip solder bump joints

doi:10.1016/0026-2714(83)91200-3

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JOURNAL ARTICLE

Reliability of flip chip solder bump joints

Year: 1983 Journal: Microelectronics Reliability Vol: 23 (3)Pages: 588-588 Publisher: Elsevier BV

DOI: 10.1016/0026-2714(83)91200-3

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Keywords:

Flip chip Reliability (semiconductor) Soldering Reliability engineering Materials science Chip Structural engineering Computer science Electronic engineering Engineering Electrical engineering Composite material Physics

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metallurgy and Material Forming

Physical Sciences → Engineering → Mechanics of Materials

Mechatronics Education and Applications

Physical Sciences → Engineering → Mechanical Engineering

Reliability of flip chip solder bump joints

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