Vibration reliability test and finite element analysis for flip chip solder joints

Fa Xing; J.H.L. Pang

doi:10.1016/j.microrel.2009.03.022

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Vibration reliability test and finite element analysis for flip chip solder joints

Fa Xing J.H.L. Pang

Year: 2009 Journal: Microelectronics Reliability Vol: 49 (7)Pages: 754-760 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2009.03.022

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Keywords:

Finite element method Structural engineering Vibration Vibration fatigue Soldering Flip chip Joint (building) Stress (linguistics) Reliability (semiconductor) Engineering Materials science Composite material Acoustics Physics

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Fatigue and fracture mechanics

Physical Sciences → Engineering → Mechanics of Materials

Mechanical stress and fatigue analysis

Physical Sciences → Engineering → Mechanics of Materials

Vibration reliability test and finite element analysis for flip chip solder joints

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