JOURNAL ARTICLE
High-aspect-ratio patterning by ClF3-Ar neutral cluster etching
Hiroki YamamotoToshio SekiJiro MatsuoKunihiko KoikeTakahiro Kozawa
Year: 2015 Journal: Microelectronic Engineering Vol: 141 Pages: 145-149 Publisher: Elsevier BV
Keywords:
Aspect ratio (aeronautics) Etching (microfabrication) Materials science Cluster (spacecraft) Beam (structure) Feature (linguistics) Cluster size Optoelectronics Analytical Chemistry (journal) Nanotechnology Optics Chemistry Computer science Physics Layer (electronics) Chromatography
Metrics
7
Cited By
0.84
FWCI (Field Weighted Citation Impact)
11
Refs
0.80
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Plasma Diagnostics and Applications
Physical Sciences → Engineering → Electrical and Electronic Engineering
Ion-surface interactions and analysis
Physical Sciences → Engineering → Computational Mechanics
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
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