Fabrication of high-aspect-ratio microstructures using dielectrophoresis-electrocapillary force-driven UV-imprinting

Abstract

We propose a novel method for fabricating high-aspect-ratio micro-/nano-structures by dielectrophoresis-electrocapillary force (DEP-ECF)-driven UV-imprinting. The force of DEP-ECF, acting on an air–liquid interface and an air–liquid–solid three-phase contact line, is generated by applying voltage between an electrically conductive mold and a substrate, and tends to pull the dielectric liquid (a UV-curable pre-polymer) into the mold micro-cavities. The existence of DEP-ECF is explained theoretically and demonstrated experimentally by the electrically induced reduction of the contact angle. Furthermore, DEP-ECF is proven to play a critical role in forcing the polymer to fill into the mold cavities by the real-time observation of the dynamic filling process. Using the DEP-ECF-driven UV-imprinting process, high-aspect-ratio polymer micro-/nano-structures (more than 10:1) are fabricated with high consistency. This patterning method can overcome the drawbacks of the mechanically induced mold deformation and position shift in conventional imprinting lithography and maximize the pattern uniformity which is usually poor in capillary force lithography.