Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

T. Waber; W. Pahl; Matthias Schmidt; Gregor Feiertag; S. Stufler; R. Dudek; Anton Leidl

doi:10.1007/s00542-013-2064-9

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Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

T. Waber W. Pahl Matthias Schmidt Gregor Feiertag S. Stufler R. Dudek Anton Leidl

Year: 2014 Journal: Microsystem Technologies Vol: 20 (4-5)Pages: 861-867 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-013-2064-9

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Keywords:

Flip chip Materials science Thermal copper pillar bump Soldering Piezoresistive effect Chip Wafer Pressure sensor Optoelectronics Wafer dicing Electronic packaging Packaging engineering Residual stress Electronic engineering Mechanical engineering Composite material Electrical engineering Engineering Adhesive

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

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