JOURNAL ARTICLE

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

T. WaberW. PahlMatthias SchmidtGregor FeiertagS. StuflerR. DudekAnton Leidl

Year: 2014 Journal:   Microsystem Technologies Vol: 20 (4-5)Pages: 861-867   Publisher: Springer Science+Business Media
Keywords:
Flip chip Materials science Thermal copper pillar bump Soldering Piezoresistive effect Chip Wafer Pressure sensor Optoelectronics Wafer dicing Electronic packaging Packaging engineering Residual stress Electronic engineering Mechanical engineering Composite material Electrical engineering Engineering Adhesive

Metrics

11
Cited By
0.74
FWCI (Field Weighted Citation Impact)
10
Refs
0.77
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced MEMS and NEMS Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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