Flip-chip packaging of piezoresistive pressure sensors

F. Campabadal; Josep Lluís Carreras; E. Cabruja

doi:10.1016/j.sna.2006.02.052

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JOURNAL ARTICLE

Flip-chip packaging of piezoresistive pressure sensors

F. Campabadal Josep Lluís Carreras E. Cabruja

Year: 2006 Journal: Sensors and Actuators A Physical Vol: 132 (1)Pages: 415-419 Publisher: Elsevier BV

DOI: 10.1016/j.sna.2006.02.052

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Keywords:

Flip chip Piezoresistive effect Sensitivity (control systems) Materials science Pressure sensor Electronic engineering Chip Signal conditioning Integrated circuit packaging Printed circuit board Electronic packaging Electronic circuit Die (integrated circuit) Electrical engineering Optoelectronics Integrated circuit Mechanical engineering Engineering Nanotechnology

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Flip-chip packaging of piezoresistive pressure sensors

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