Flip-chip packaging of piezoresistive barometric pressure sensors

T. Waber; W. Pahl; Matthias Schmidt; Gregor Feiertag; S. Stufler; R. Dudek; Anton Leidl

doi:10.1117/12.2016459

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Flip-chip packaging of piezoresistive barometric pressure sensors

T. Waber W. Pahl Matthias Schmidt Gregor Feiertag S. Stufler R. Dudek Anton Leidl

Year: 2013 Journal: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Vol: 8763 Pages: 87632D-87632D Publisher: SPIE

DOI: 10.1117/12.2016459

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Abstract

Paper 87632D

Keywords:

Flip chip Materials science Piezoresistive effect Soldering Thermal copper pillar bump Wafer Wafer dicing Pressure sensor Optoelectronics Chip Electronic packaging Substrate (aquarium) Packaging engineering Wafer bonding Residual stress Electronic engineering Composite material Electrical engineering Mechanical engineering Adhesive Engineering

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Topics

Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Adhesion, Friction, and Surface Interactions

Physical Sciences → Engineering → Mechanics of Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Flip-chip packaging of piezoresistive barometric pressure sensors

Abstract

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Citation History

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