Placement-aware 3D floorplanning

Abstract

We present a novel 3D floorplanning algorithm with module splitting (3D-FMS). The proposed methodology allows designers to introduce and evaluate an assignment of vertically-aligned parts of the same module to different device layers. Our experimental results on MCNC and GSRC benchmarks show that 3D-FMS can generate a good floorplanning solution with reduced wirelength inside modules and optimized footprint area while controlling the number of vias. Compared to the existing state-of-the-art 3D floorplanning algorithms, 3D-FMS reduces the system level total wirelength by 7.9%.