A wafer-scale etching technique for high aspect ratio implantable MEMS structures

Rajmohan Bhandari; Sandeep Negi; Loren Rieth; Florian Solzbacher

doi:10.1016/j.sna.2010.06.011

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A wafer-scale etching technique for high aspect ratio implantable MEMS structures

Rajmohan Bhandari Sandeep Negi Loren Rieth Florian Solzbacher

Year: 2010 Journal: Sensors and Actuators A Physical Vol: 162 (1)Pages: 130-136 Publisher: Elsevier BV

DOI: 10.1016/j.sna.2010.06.011

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Keywords:

Wafer dicing Wafer Etching (microfabrication) Microelectromechanical systems Materials science Electrode Fabrication Optoelectronics Deep reactive-ion etching Dry etching Reactive-ion etching Silicon Isotropic etching Nanotechnology Chemistry Layer (electronics)

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Neuroscience and Neural Engineering

Life Sciences → Neuroscience → Cellular and Molecular Neuroscience

Advanced Memory and Neural Computing

Physical Sciences → Engineering → Electrical and Electronic Engineering

Analytical Chemistry and Sensors

Physical Sciences → Chemical Engineering → Bioengineering

A wafer-scale etching technique for high aspect ratio implantable MEMS structures

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