Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

Shu Ni; Erwin Berenschot; Pieter Westerik; Meint J. de Boer; René Wolf; Hai Le The; Han Gardeniers; Niels R. Tas

doi:10.1038/s41378-020-0134-6

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Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

Shu Ni Erwin Berenschot Pieter Westerik Meint J. de Boer René Wolf Hai Le The Han Gardeniers Niels R. Tas

Year: 2020 Journal: Microsystems & Nanoengineering Vol: 6 (1)Pages: 25-25 Publisher: Springer Nature

DOI: 10.1038/s41378-020-0134-6

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Keywords:

Wafer Etching (microfabrication) Lithography Materials science Miniaturization Plasma etching Reactive-ion etching Deep reactive-ion etching Machining Photoresist Photolithography Optoelectronics Silicon Aspect ratio (aeronautics) Plasma Nanotechnology Metallurgy

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Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Nanowire Synthesis and Applications

Physical Sciences → Engineering → Biomedical Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

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