Disruptive Wafer-Level Package-On-Package Technology

Abstract

ABSTRACT Semiconductor packaging IP design house RFMOD Ltd. (Cambridge UK), is proud to debut its WLPoP™ technology at IWLPC 2011. A new, potentially disruptive, Wafer-Level Chip-Scale packaging technology (US and Taiwan Patent Pending) is presented which introduces the stacking/ nesting of multiple heterogeneous WLCSP devices chips without the use of expensive substrates [no embedding], fan-out wafers, silicon interposers or Thru-Silicon-Vias (TSV). The technology construction, application and benefits, are presented together with methods for mitigation and optimization of assembly yield, through the use of pre-tested “known-good” WLCSPs from multiple wafers. A brief explanation of its application to high volume target markets and the company's plans to introduce the technology is given.