Recent Trends in Wafer-Level Package Technology

Abstract

The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.