Experimental and Numerical Investigation of Solder Joint Reliability of Ball Grid Array Package under Board level Drop Test

doi:10.62441/nano-ntp.v20i6.61

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Experimental and Numerical Investigation of Solder Joint Reliability of Ball Grid Array Package under Board level Drop Test

Year: 2024 Journal: Nanotechnology Perceptions Vol: 20 (6)

DOI: 10.62441/nano-ntp.v20i6.61

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Keywords:

Ball grid array Drop test Chip-scale package Soldering Ball (mathematics) Grid Drop (telecommunication) Quad Flat No-leads package Reliability (semiconductor) Structural engineering Engineering Materials science Mechanical engineering Composite material Chip Mathematics Adhesive Electrical engineering Physics Geometry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

VLSI and Analog Circuit Testing

Physical Sciences → Computer Science → Hardware and Architecture

Silicon and Solar Cell Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Experimental and Numerical Investigation of Solder Joint Reliability of Ball Grid Array Package under Board level Drop Test

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