DISSERTATION
Ball grid array solder joint reliability under impact test
Keywords:
Ball grid array Joint (building) Soldering Reliability (semiconductor) Reliability engineering Grid Structural engineering Computer science Engineering Mechanical engineering Materials science Composite material Geology Physics
Metrics
0
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences → Engineering → Electrical and Electronic Engineering
VLSI and Analog Circuit Testing
Physical Sciences → Computer Science → Hardware and Architecture
Related Documents
JOURNAL ARTICLE
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Ming‐Hwa R. JenLee‐Cheng LiuJ.D. Wu
Journal: Journal of Electronic Packaging Year: 2005 Vol: 127 (4)Pages: 446-451
JOURNAL ARTICLE
Ball Grid Array Solder Joint Reliability Under System-Level Compressive Load
Tz-Cheng ChiuDarvin EdwardsMudasir Ahmad
Journal: IEEE Transactions on Device and Materials Reliability Year: 2010 Vol: 10 (3)Pages: 324-337
JOURNAL ARTICLE
Design for Plastic Ball Grid Array Solder Joint Reliability
Journal: Circuit World Year: 1997 Vol: 23 (2)Pages: 11-13
JOURNAL ARTICLE
Solder joint reliability of plastic ball grid array packages
Journal: Soldering and Surface Mount Technology Year: 1999 Vol: 11 (1)Pages: 44-48
JOURNAL ARTICLE
Ball-grid-array solder joint model for assembly-level impact reliability prediction
Chee Kuang KokWen Jie NgChin Chin OoiKia Wai Liew
Journal: Microelectronics Reliability Year: 2016 Vol: 65 Pages: 184-191