DISSERTATION

Ball grid array solder joint reliability under impact test

Keywords:
Ball grid array Joint (building) Soldering Reliability (semiconductor) Reliability engineering Grid Structural engineering Computer science Engineering Mechanical engineering Materials science Composite material Geology Physics

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Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
VLSI and Analog Circuit Testing
Physical Sciences →  Computer Science →  Hardware and Architecture

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