JOURNAL ARTICLE

Ball-grid-array solder joint model for assembly-level impact reliability prediction

Chee Kuang KokWen Jie NgChin Chin OoiKia Wai Liew

Year: 2016 Journal:   Microelectronics Reliability Vol: 65 Pages: 184-191   Publisher: Elsevier BV
Keywords:
Ball grid array Soldering Intermetallic Materials science Structural engineering Flip chip Reliability (semiconductor) Finite element method Chip-scale package Joint (building) Metallurgy Composite material Layer (electronics) Engineering Alloy Adhesive

Metrics

4
Cited By
0.32
FWCI (Field Weighted Citation Impact)
56
Refs
0.67
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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