Ball-grid-array solder joint model for assembly-level impact reliability prediction

Chee Kuang Kok; Wen Jie Ng; Chin Chin Ooi; Kia Wai Liew

doi:10.1016/j.microrel.2016.08.001

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JOURNAL ARTICLE

Ball-grid-array solder joint model for assembly-level impact reliability prediction

Chee Kuang Kok Wen Jie Ng Chin Chin Ooi Kia Wai Liew

Year: 2016 Journal: Microelectronics Reliability Vol: 65 Pages: 184-191 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2016.08.001

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Keywords:

Ball grid array Soldering Intermetallic Materials science Structural engineering Flip chip Reliability (semiconductor) Finite element method Chip-scale package Joint (building) Metallurgy Composite material Layer (electronics) Engineering Alloy Adhesive

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

Ball-grid-array solder joint model for assembly-level impact reliability prediction

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