JOURNAL ARTICLE
Dynamic responses and solder joint reliability under board level drop test
Jing-en LuanTong Yan TeeE. PekChwee Teck LimZ.W. Zhong
Year: 2007 Journal: Microelectronics Reliability Vol: 47 (2-3)Pages: 450-460 Publisher: Elsevier BV
Keywords:
Drop test Drop impact Soldering Joint (building) Reliability (semiconductor) Drop (telecommunication) Dynamic testing Bending Repeatability Structural engineering Printed circuit board Dynamic loading Shock (circulatory) Engineering Materials science Composite material Mechanical engineering Splash Electrical engineering
Metrics
44
Cited By
5.26
FWCI (Field Weighted Citation Impact)
8
Refs
0.96
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electrostatic Discharge in Electronics
Physical Sciences → Engineering → Electrical and Electronic Engineering
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