Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test

Abstract

The integrated passives device (IPD) is an advanced substrate with embedded passives. The device is mounted to the board with lead-free solder joints. Detailed solder joint reliability models are established for both drop test and thermal cycling test for IPD packages. For drop test, the critical solder joints are observed along the outermost row in the PCB length direction. For thermal cycling test, the critical solder joint is observed at the outermost package corner, with possible failure along the solder/IPD pad interface. The distance to neutral point effect is dominant for IPD structures under drop test and thermal cycling tests. However, drop test performance is more dependent on PCB geometry, compared with the thermal cycling test. Drop test and thermal cycling test have different failure mechanisms and distinct failure modes.