Robust Edge Coupling Probe Applied in Wafer-Level Optical Testing

Abstract

In this paper, we propose a wafer-level optical testing technique for measuring edge couplers and design a robust edge coupling probe to apply in this work. The probe provides a long and small-diameter protrusion fiber array, which can easily extend into the micro trench and further reduce the working distance to improve the coupling efficiency. The testing results show the probe can effectively measure the optical loss of the edge coupler, and is also suitable for edge coupler with higher surface roughness. The fiber of the probe can stably and reliably measure the optical waveguide of edge coupler at different positions on a wafer.