JOURNAL ARTICLE

Through-Silicon Via Fill for 3D Interconnect Applications

Varughese MathewRitwik ChatterjeeRobert E. JonesSam GarciaEddie AcostaZhihong Huang

Year: 2008 Journal:   ECS Meeting Abstracts Vol: MA2008-02 (38)Pages: 2515-2515   Publisher: Institute of Physics

Abstract

Abstract not Available.

Keywords:
Interconnection Silicon Materials science Optoelectronics Computer science Telecommunications

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Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor Lasers and Optical Devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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