JOURNAL ARTICLE
Through-Silicon Via Fill for 3D Interconnect Applications
Varughese MathewRitwik ChatterjeeRobert E. JonesSam GarciaEddie AcostaZhihong Huang
Year: 2008 Journal: ECS Meeting Abstracts Vol: MA2008-02 (38)Pages: 2515-2515 Publisher: Institute of Physics
Abstract
Abstract not Available.
Keywords:
Interconnection Silicon Materials science Optoelectronics Computer science Telecommunications
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Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor Lasers and Optical Devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
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