Advanced Hi-Fill® for interconnect liner applications

N. Urbansky; S. Burgess; S. Schmidbauer; U Heydenreich; H Donohue; I Moncrieff; C Görgens

doi:10.1016/s0167-9317(02)00787-6

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Advanced Hi-Fill® for interconnect liner applications

N. Urbansky S. Burgess S. Schmidbauer U Heydenreich H Donohue I Moncrieff C Görgens

Year: 2002 Journal: Microelectronic Engineering Vol: 64 (1-4)Pages: 99-105 Publisher: Elsevier BV

DOI: 10.1016/s0167-9317(02)00787-6

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Keywords:

Interconnection Dram Tin Materials science Tungsten Contact resistance Spark plug Deposition (geology) Optoelectronics Nanotechnology Computer science Metallurgy Mechanical engineering Engineering Layer (electronics) Telecommunications

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Advanced Hi-Fill® for interconnect liner applications

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