BOOK-CHAPTER

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging

Jeong Won YoonSeung Boo Jung

Year: 2006 Advanced materials research Pages: 1001-1007   Publisher: Trans Tech Publications
Keywords:
Soldering Materials science Joint (building) Metallurgy Composite material Structural engineering Engineering

Metrics

0
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.46
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences →  Engineering →  Mechanical Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

Related Documents

JOURNAL ARTICLE

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging

Jeong Won YoonSeung Boo Jung

Journal:   Advanced materials research Year: 2006 Vol: 15-17 Pages: 1001-1007
JOURNAL ARTICLE

Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging

Jeong‐Won YoonWon-Chul MoonSeung‐Boo Jung

Journal:   Microelectronic Engineering Year: 2006 Vol: 83 (11-12)Pages: 2329-2334
JOURNAL ARTICLE

Effect of surface finish on interfacial reactions of Cu/Sn–Ag–Cu/Cu(ENIG) sandwich solder joints

Jeong‐Won YoonSeung‐Boo Jung

Journal:   Journal of Alloys and Compounds Year: 2006 Vol: 448 (1-2)Pages: 177-184
© 2026 ScienceGate Book Chapters — All rights reserved.