JOURNAL ARTICLE
Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
Jeong‐Won YoonWon-Chul MoonSeung‐Boo Jung
Year: 2006 Journal: Microelectronic Engineering Vol: 83 (11-12)Pages: 2329-2334 Publisher: Elsevier BV
Keywords:
Materials science Intermetallic Soldering Metallurgy Alloy
Metrics
38
Cited By
2.35
FWCI (Field Weighted Citation Impact)
11
Refs
0.90
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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