Effect of surface finish on interfacial reactions of Cu/Sn–Ag–Cu/Cu(ENIG) sandwich solder joints

JOURNAL ARTICLE

Year: 2006 Journal: Journal of Alloys and Compounds Vol: 448 (1-2)Pages: 177-184 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2006.10.052

Keywords:

Soldering Intermetallic Materials science Layer (electronics) Metallurgy Isothermal process Copper Composite material Alloy

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0.34

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0.64

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering