JOURNAL ARTICLE

Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers

Year: 1990 Journal:   Microelectronics Reliability Vol: 30 (1)Pages: 191-191   Publisher: Elsevier BV
Keywords:
Soldering Thermal expansion Materials science Ceramic Printed circuit board Joint (building) Chip Composite material Solder paste Mechanical engineering Electrical engineering Structural engineering Engineering

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Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electrical and Thermal Properties of Materials
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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