Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers

doi:10.1016/0026-2714(90)90049-s

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Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers

Year: 1990 Journal: Microelectronics Reliability Vol: 30 (1)Pages: 191-191 Publisher: Elsevier BV

DOI: 10.1016/0026-2714(90)90049-s

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Keywords:

Soldering Thermal expansion Materials science Ceramic Printed circuit board Joint (building) Chip Composite material Solder paste Mechanical engineering Electrical engineering Structural engineering Engineering

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electrical and Thermal Properties of Materials

Physical Sciences → Engineering → Electrical and Electronic Engineering

Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers

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