Direct attachment of leadless chip carriers to organic matrix printed wiring boards

doi:10.1016/0026-2714(84)90308-1

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Direct attachment of leadless chip carriers to organic matrix printed wiring boards

Year: 1984 Journal: Microelectronics Reliability Vol: 24 (4)Pages: 812-812 Publisher: Elsevier BV

DOI: 10.1016/0026-2714(84)90308-1

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Keywords:

Printed circuit board Chip Matrix (chemical analysis) Materials science Electrical engineering Electronic engineering Optoelectronics Engineering Composite material

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Recycling and Waste Management Techniques

Physical Sciences → Environmental Science → Industrial and Manufacturing Engineering

Direct attachment of leadless chip carriers to organic matrix printed wiring boards

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