Effect of geometry on solder joint reliability of leadless leadframe package

Hsiu-Hsin Chung

doi:10.31979/etd.hm3x-v3j2

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Effect of geometry on solder joint reliability of leadless leadframe package

Hsiu-Hsin Chung

Year: 2004

DOI: 10.31979/etd.hm3x-v3j2

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Abstract

Effect of geometry on solder

Keywords:

Soldering Joint (building) Reliability (semiconductor) Materials science Mechanical engineering Engineering drawing Metallurgy Geometry Structural engineering Engineering Mathematics Physics

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Aluminum Alloy Microstructure Properties

Physical Sciences → Engineering → Aerospace Engineering

Metallurgy and Material Forming

Physical Sciences → Engineering → Mechanics of Materials

Effect of geometry on solder joint reliability of leadless leadframe package

Abstract

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