Solder Joint Reliability of Leadless Chip Carriers

J.T. Lynch; A. Boetti

doi:10.1007/978-1-4684-7767-2_18

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Solder Joint Reliability of Leadless Chip Carriers

J.T. Lynch A. Boetti

Year: 1993 Pages: 579-606

DOI: 10.1007/978-1-4684-7767-2_18

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Keywords:

Printed circuit board Interconnection Reliability (semiconductor) Soldering Chip Integrated circuit Electronics Joint (building) Engineering Electronic circuit Electrical engineering Electronic engineering Computer science Materials science Telecommunications Structural engineering Composite material

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Cited By

2.05

FWCI (Field Weighted Citation Impact)

Refs

0.81

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Solder Joint Reliability of Leadless Chip Carriers

Metrics

Topics

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