JOURNAL ARTICLE

Thermal-structural optimization and reliability of leadframe solder joint geometry in electronic packaging

Keywords:
Soldering Reliability (semiconductor) Electronic packaging Joint (building) Materials science Thermal Mechanical engineering Structural engineering Metallurgy Engineering drawing Composite material Engineering

Metrics

2
Cited By
0.00
FWCI (Field Weighted Citation Impact)
53
Refs
0.06
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Metallurgical and Alloy Processes
Physical Sciences →  Materials Science →  General Materials Science

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