Thermal-structural optimization and reliability of leadframe solder joint geometry in electronic packaging

K. Nelson-Owusu

doi:10.6083/m4w957hh

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Thermal-structural optimization and reliability of leadframe solder joint geometry in electronic packaging

K. Nelson-Owusu

Year: 2000

DOI: 10.6083/m4w957hh

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Keywords:

Soldering Reliability (semiconductor) Electronic packaging Joint (building) Materials science Thermal Mechanical engineering Structural engineering Metallurgy Engineering drawing Composite material Engineering

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metallurgical and Alloy Processes

Physical Sciences → Materials Science → General Materials Science

Thermal-structural optimization and reliability of leadframe solder joint geometry in electronic packaging

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