Low temperature seamless joining of SiC using a Ytterbium film

Linkun Shi; Xiaobing Zhou; Kai Xu; Keke Chang; Jian‐Qing Dai; Qing Huang

doi:10.1016/j.jeurceramsoc.2021.08.057

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Low temperature seamless joining of SiC using a Ytterbium film

Linkun Shi Xiaobing Zhou Kai Xu Keke Chang Jian‐Qing Dai Qing Huang Qing Huang

Year: 2021 Journal: Journal of the European Ceramic Society Vol: 41 (15)Pages: 7507-7515 Publisher: Elsevier BV

DOI: 10.1016/j.jeurceramsoc.2021.08.057

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Keywords:

Materials science Eutectic system Sintering Composite material Joint (building) Composite number Ytterbium Phase (matter) Coating Alloy Doping Optoelectronics

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Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Low temperature seamless joining of SiC using a Ytterbium film

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