Anisotropic conductive film flip chip joining using thin chips

Erja Jokinen; E. Ristolainen

doi:10.1016/s0026-2714(02)00100-2

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Anisotropic conductive film flip chip joining using thin chips

Erja Jokinen E. Ristolainen

Year: 2002 Journal: Microelectronics Reliability Vol: 42 (12)Pages: 1913-1920 Publisher: Elsevier BV

DOI: 10.1016/s0026-2714(02)00100-2

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Keywords:

Flip chip Materials science Polyethylene naphthalate Composite material Temperature cycling Bending Electrical conductor Joint (building) Scanning electron microscope Thin film Reliability (semiconductor) Chip Structural engineering Thermal Nanotechnology Electrical engineering Polymer Adhesive Layer (electronics) Engineering

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Anisotropic conductive film flip chip joining using thin chips

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