JOURNAL ARTICLE

Anisotropic conductive film flip chip joining using thin chips

Erja JokinenE. Ristolainen

Year: 2002 Journal:   Microelectronics Reliability Vol: 42 (12)Pages: 1913-1920   Publisher: Elsevier BV
Keywords:
Flip chip Materials science Polyethylene naphthalate Composite material Temperature cycling Bending Electrical conductor Joint (building) Scanning electron microscope Thin film Reliability (semiconductor) Chip Structural engineering Thermal Nanotechnology Electrical engineering Polymer Adhesive Layer (electronics) Engineering

Metrics

22
Cited By
1.25
FWCI (Field Weighted Citation Impact)
14
Refs
0.82
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanofabrication and Lithography Techniques
Physical Sciences →  Engineering →  Biomedical Engineering
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