Seamless joining of porous membrane with thermoplastic microfluidic devices

Z. F. Wang; Yen Peng Seah; Z.P. Wang

doi:10.1016/j.mee.2013.02.074

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JOURNAL ARTICLE

Seamless joining of porous membrane with thermoplastic microfluidic devices

Z. F. Wang Yen Peng Seah Z.P. Wang Z.P. Wang Z.P. Wang

Year: 2013 Journal: Microelectronic Engineering Vol: 110 Pages: 386-391 Publisher: Elsevier BV

DOI: 10.1016/j.mee.2013.02.074

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Keywords:

Materials science Membrane Polycarbonate Thermoplastic Microfluidics Embossing Polymer Composite material Porosity Substrate (aquarium) Fabrication Anodic bonding Nanotechnology Layer (electronics) Chemistry

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Microfluidic and Capillary Electrophoresis Applications

Physical Sciences → Engineering → Biomedical Engineering

Microfluidic and Bio-sensing Technologies

Physical Sciences → Engineering → Biomedical Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Seamless joining of porous membrane with thermoplastic microfluidic devices

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