JOURNAL ARTICLE
Multichip packaging technology with laser-patterned interconnects
Year: 1990 Journal: Microelectronics Reliability Vol: 30 (6)Pages: 1210-1210 Publisher: Elsevier BV
Keywords:
Direct bonding Silicon Materials science Silicon on insulator Actuator Laser Wire bonding Hybrid silicon laser Nanotechnology Electronic engineering Optoelectronics Engineering physics Electrical engineering Engineering Optics Physics
Metrics
0
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.36
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Topics
Semiconductor Lasers and Optical Devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Surface Polishing Techniques
Physical Sciences → Engineering → Biomedical Engineering
Related Documents
JOURNAL ARTICLE
Multichip packaging technology with laser-patterned interconnects
A.T. BarfknechtDavid B. TuckermanJ.L. KaschmitterBruce M. McWilliams
Journal: Proceedings., 39th Electronic Components Conference Year: 2003 Vol: 31 Pages: 663-667
JOURNAL ARTICLE
Multichip packaging technology with laser-patterned interconnects
A.T. BarfknechtDavid B. TuckermanJ.L. KaschmitterBruce M. McWilliams
Journal: IEEE Transactions on Components Hybrids and Manufacturing Technology Year: 1989 Vol: 12 (4)Pages: 646-649
BOOK-CHAPTER
Wafer-Scale Multichip Packaging Technology
Wayne JohnsonR.C. JaegerTravis N. Blalock
Year: 1989 Pages: 473-499
JOURNAL ARTICLE
Hybrid wafer scale packaging of laser diodes and multichip module technology
Paul O. HaugsjaaCraig ArmientoP. Melman
Journal: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Year: 1992 Vol: 1634 Pages: 440-440