JOURNAL ARTICLE

Multichip packaging technology with laser-patterned interconnects

Year: 1990 Journal:   Microelectronics Reliability Vol: 30 (6)Pages: 1210-1210   Publisher: Elsevier BV
Keywords:
Direct bonding Silicon Materials science Silicon on insulator Actuator Laser Wire bonding Hybrid silicon laser Nanotechnology Electronic engineering Optoelectronics Engineering physics Electrical engineering Engineering Optics Physics

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Topics

Semiconductor Lasers and Optical Devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Surface Polishing Techniques
Physical Sciences →  Engineering →  Biomedical Engineering

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